Affective Technē: Art, Care and Creative Futures symposium

Event information
Date and time

15–17 Oct 2026

Location

LASALLE’s McNally Campus

Registration
The event is open to all and free of charge.
Register now

Event information

Date and time

15–17 Oct 2026

Location

LASALLE’s McNally Campus

Registration
The event is open to all and free of charge.
Register now

Event details

Affective Technē: Art, Care and Creative Futures is an international symposium bringing together artists, academics, students and members of the creative industries from across the Asia Pacific to examine the evolving intersections of art, technology and care.

As artificial intelligence (AI), automation and ecological precarity reshape our cultural and communal landscapes, this symposium asks how creative practices can foster new forms of affective intelligence, ethical engagement and sustainable making. Drawing on the concept of technē—the skilled, thoughtful craft of making and a root word for both technology and technique—participants will consider creative futures that are both technologically agile and grounded in care, empathy and ecological responsibility.

Hosted by LASALLE College of the Arts and RMIT University at LASALLE’s McNally Campus in Singapore, Affective Technē invites discourse and dialogue across art, design, education and technologies. Through a series of keynotes, panels, workshops, and field trips, this symposium aims to build transdisciplinary networks and shared practices that advance more caring, adaptive and forward-looking approaches to creativity and pedagogy.

Please be advised that photography and video recording will take place throughout this conference. By attending, you consent to your likeness being captured and used by the organisers for archival, academic reports and promotional purposes. If you do not wish to be photographed, please inform the registration desk upon arrival to collect an opt-out sticker.

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Applications

Application for August 2026 intake is open until places are filled. Click here for more information about the application process and closing date.

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